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Broadcom Unveils New Technology to Accelerate Custom Chips Amid Rising Generative AI Demand

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Headline: Broadcom introduces 3.5D XDSiP technology to enhance AI processor performance, targeting production shipments by February 2026.
Article: Broadcom has announced its 3.5D XDSiP technology, designed to improve the performance of custom AI processors by integrating more memory within each chip and enabling direct connections among critical components. This advancement aims to meet the growing demand for generative AI infrastructure, with production shipments expected to commence by February 2026.
Date: December 5, 2024
Read Full Article: Reuters.com

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AGL Staff Writer

AGL’s dedicated Staff Writers are experts in the digital ecosystem, focusing on developments across broadband, infrastructure, federal programs, technology, AI, and machine learning. They provide in-depth analysis and timely coverage on topics impacting connectivity and innovation, especially in underserved areas. With a commitment to factual reporting and clarity, AGL Staff Writers offer readers valuable insights on industry trends, policy changes, and technological advancements that shape the future of telecommunications and digital equity. Their work is essential for professionals seeking to understand the evolving landscape of broadband and technology in the U.S. and beyond.

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