Broadcom Unveils New Technology to Accelerate Custom Chips Amid Rising Generative AI Demand

Headline: Broadcom introduces 3.5D XDSiP technology to enhance AI processor performance, targeting production shipments by February 2026.
Article: Broadcom has announced its 3.5D XDSiP technology, designed to improve the performance of custom AI processors by integrating more memory within each chip and enabling direct connections among critical components. This advancement aims to meet the growing demand for generative AI infrastructure, with production shipments expected to commence by February 2026.
Date: December 5, 2024
Read Full Article: Reuters.com

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